The slicing of Silicon wafer is a complex manufacturing process in producing the raw materials for electronic chips and requires the efforts to effectively monitor the stability in production line and ensure the quality for the products composed of different shapes and materials. Human decision failure and other analytical errors are the most common source of management problems in such manufacturing stage. This paper presents a case regarding the silicon wafer manufacturing to examine the response to quality errors. The study has adopted the approach of grey situation decision-making algorithm for problem detection that suggests a technique to attain the quality control and reduce potential costs in production.
Chang, Che-Wei and Wang, William Yu Chung
"Grey Situation Decision-making Algorithm to Optimize Silicon Wafer Slicing,"
Journal of International Technology and Information Management: Vol. 15
, Article 6.
Available at: http://scholarworks.lib.csusb.edu/jitim/vol15/iss3/6